Open AccessAnodic bonding Characteristics of MLCA to Si-wafer Using Evaporated Pyrex #7740 Glass Thin-Films for MEMS Applications
Author(s) -
GwiySang Chung,
Jae-Min Kim,
Suk-Jin Yoon
Publication year - 2003
Publication title -
senseo haghoeji
Language(s) - English
Resource type - Journals
eISSN - 2093-7563
pISSN - 1225-5475
DOI - 10.5369/jsst.2003.12.6.265
Subject(s) - materials science , wafer , microelectromechanical systems , anodic bonding , wafer bonding , annealing (glass) , fabrication , thin film , composite material , optoelectronics , electronic engineering , nanotechnology , engineering , medicine , alternative medicine , pathology