Open AccessSURFACE FORCES IN CHEMICAL MECHANICAL PLANARIZATION AND SEMICONDUCTOR WAFER CLEANING SYSTEMS
Author(s) -
Lukasz Hupka
Publication year - 2021
Publication title -
wiadomości chemiczne
Language(s) - English
Resource type - Journals
eISSN - 2300-0295
pISSN - 0043-5104
DOI - 10.53584/wiadchem.2021.10.5
Subject(s) - chemical mechanical planarization , wafer , semiconductor , semiconductor industry , materials science , semiconductor device fabrication , surface (topology) , optoelectronics , nanotechnology , polishing , metallurgy , engineering , manufacturing engineering , mathematics , geometry