Open AccessDesign and Analysis of NCP Packaging Process for Fine-Pitch Flexible Printed Circuit Board
Author(s) -
Jaehong Shim,
Dong-Hyuk Cha
Publication year - 2010
Publication title -
journal of institute of control robotics and systems
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.215
H-Index - 11
eISSN - 2233-4335
pISSN - 1976-5622
DOI - 10.5302/j.icros.2010.16.2.172
Subject(s) - liquid crystal display , pixel , process (computing) , printed circuit board , chip , electrical conductor , materials science , computer science , integrated circuit packaging , key (lock) , process engineering , electronic engineering , automotive engineering , optoelectronics , engineering , composite material , telecommunications , artificial intelligence , computer security , operating system
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