Open AccessUltrasonic ACF Bonding Technique for Mounting LCD Driver ICs
Publication year - 2008
Publication title -
je-eo lobos siseutem haghoe nonmunji/jeeo robot siseutem hakoe nonmunji
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.215
H-Index - 11
eISSN - 2233-4335
pISSN - 1976-5622
DOI - 10.5302/j.icros.2008.14.6.543
Subject(s) - ultrasonic sensor , materials science , liquid crystal display , wire bonding , process (computing) , compression (physics) , isotropic solid , electronic engineering , acoustics , optoelectronics , composite material , isotropy , electrical engineering , computer science , engineering , optics , chip , physics , operating system