Open AccessA Measurement of Size of the Open Crack using Ultrasound Thermography
Author(s) -
Jai-Wan Cho,
YongChil Seo,
Seungho Jung,
Hyun-Kyu Jung,
SeungHo Kim
Publication year - 2007
Publication title -
journal of control automation and systems engineering
Language(s) - English
Resource type - Journals
ISSN - 1225-9845
DOI - 10.5302/j.icros.2007.13.3.218
Subject(s) - hot spot (computer programming) , materials science , ultrasonic sensor , thermography , dissipation , crack tip opening displacement , ultrasound , excitation , acoustics , composite material , fracture mechanics , optics , crack closure , infrared , electrical engineering , physics , computer science , thermodynamics , engineering , operating system
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