Open AccessAnalisis Proses Transfer Molding Pembuatan Semiconductor Package Pada New Remocon
Author(s) -
Kardiman Rizky Miftahul Amri
Publication year - 2022
Publication title -
zenodo (cern european organization for nuclear research)
Language(s) - Uncategorized
DOI - 10.5281/zenodo.6609332
Subject(s) - materials science , molding (decorative) , semiconductor , transfer molding , composite material , optoelectronics , mold