Open AccessElectroless and Electrodeposition of Silver from a Choline Chloride-Based Ionic Liquid
Author(s) -
Md. Hasan Ali,
Muhammad Ziaur Rahman,
Siddhartha Sankar Saha
Publication year - 2015
Publication title -
pakistan journal of scientific and industrial research. series a: physical sciences
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.136
H-Index - 4
eISSN - 2223-2559
pISSN - 2221-6413
DOI - 10.52763/pjsir.phys.sci.58.2.2015.66.73
Subject(s) - choline chloride , ionic liquid , ethylene glycol , inorganic chemistry , silver nitrate , scanning electron microscope , materials science , chloride , electrolyte , deposition (geology) , chemical engineering , chemistry , nuclear chemistry , catalysis , metallurgy , electrode , composite material , organic chemistry , paleontology , sediment , biology , engineering
The electroless and electrolytic deposition of silver from a solution containing silver nitrate in either an ethylene glycol (EG)-choline chloride based or a urea-choline chloride based ionic liquids has been carried out onto steel and copper cathodes by simple immersion, constant current and constant potential methods at room temperature. It has been found that electroless silver deposits of up to several micronshave been obtained by dip coating from both urea and EG based ionic liquids without the use of catalysts. The influences of various experimental conditions on electrodeposition and morphology of the deposited layers have been investigated by scanning electron microscopy (SEM) and X-ray diffraction (XRD). It has been observed that crack free bright metallic coloured silver coatings can be obtained from both EG and urea based ionic liquids at the applied deposition potentials up to -0.40 V and applied deposition current densities up to -5.0 A m-2 at room temperature. The cathodic current efficiency for the deposition of Ag is about 99%.