Open AccessAn Investigation on Splat and Flattening Behavior of Thermally Sprayed Copper on A Rough Surface: A New Approach
Author(s) -
Satish Tailor,
Nitesh Vashishtha,
Ankur Modi,
S. C. Modi
Publication year - 2020
Publication title -
journal of thermal spray and engineering
Language(s) - English
Resource type - Journals
ISSN - 2582-1474
DOI - 10.52687/2582-1474/211
Subject(s) - flattening , materials science , copper , thermal spraying , traverse , metallurgy , grit , thermal , surface (topology) , rough surface , composite material , geometry , coating , mathematics , geology , psychology , developmental psychology , physics , geodesy , meteorology
All thermal spray coatings are finally deposited on a rough and active grit-blasted surface of the job. But, available literatures are reporting splat and flattening behavior on a polished surface. There is a gap in thermal spraying to understand actual solidification on a rough surface. Therefore, in the present work an attempt has been made to study of splat formation of thermally sprayed copper onto grit-blasted rough surface. An optimization study is done to collect rounded/semi-rounded disk like splats to set spray parameters. Optimized parameters were also tested at four different gun traverse speeds to fabricate thin Cu coatings (30-50µm).