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KEHILANGAN MASSA PADA LARUTAN HCL DAN NACl BAJA KARBON RENDAH HASIL ELEKTROPLATING TEMBAGA-NIKEL
Author(s) -
Ferry Budhi Susetyo,
Siska Titik Dwiyati,
Muhammad Teguh Pangestu
Publication year - 2019
Publication title -
jurnal kajian teknik mesin
Language(s) - English
Resource type - Journals
ISSN - 2406-9671
DOI - 10.52447/jktm.v4i1.1471
Subject(s) - nuclear chemistry , physics , nickel , copper , chemistry , metallurgy , materials science
AbstrakPenelitian ini bertujuan untuk mengetahui perilaku hasil elektroplating tembaga – nikel terhadap larutan 3.5% HCl dan 3.5% NaCl. Proses elektroplating terbagi menjadi 2 bagian yaitu elektroplating tembaga selama 10 menit, kemudian dilanjutkan dengan nikel selama 20 menit. Dari hasil penelitian yang dilakukan, didapatkan kesimpulan spesimen yang melakukan perendaman dengan larutan 3,5 % HCl memiliki kehilangan massa lebih besar dibandingkan dengan spesimen yang melakukan perendaman dengan larutan 3,5% NaCl. Kata kunci: elektroplating, tembaga, nikel, HCl, NaCl, korosi AbstractThis study aims to determine the behavior of copper-nickel electroplating on a solution of 3.5% HCl and 3.5% NaCl. The electroplating process is divided into 2 parts, copper electroplating for 10 minutes, then followed by nickel for 20 minutes. From the results of the research conducted, it was concluded that the specimens that immersed with a 3.5% HCl solution had a greater mass loss compared to the specimens which immersed with a 3.5% NaCl solution. Keywords: electroplating, copper, nickel, HCl, NaCl, corrosion

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