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Influence of Chemical Composition of Pyrophosphate Copper Baths on Properties of Electrodeposited Cu Films
Author(s) -
Dong-Yul Shin,
Bon-Keup Koo,
Deok-Yong Park
Publication year - 2015
Publication title -
journal of the korean electrochemical society
Language(s) - English
Resource type - Journals
eISSN - 2288-9000
pISSN - 1229-1935
DOI - 10.5229/jkes.2015.18.1.7
Subject(s) - copper , chemical composition , pyrophosphate , analytical chemistry (journal) , composition (language) , materials science , chemistry , nuclear chemistry , metallurgy , organic chemistry , enzyme , biochemistry , linguistics , philosophy , chromatography

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