
Development of Side Forming Technology for the Tooth Part Using B.T.Pin in Cold Forming Process
Author(s) -
J.S. Lee,
S.J. Park,
B.M. Kim,
D.H. Kim
Publication year - 2017
Publication title -
so'seong ga'gong/soseong gagong
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kstp.2017.26.2.95
Subject(s) - materials science , die (integrated circuit) , cold forming , process (computing) , forming processes , fracture (geology) , structural engineering , composite material , engineering , computer science , operating system , nanotechnology