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Evaluation of Cooling Capability of Hot Press Forming Die with Thermal CFD Simulation
Author(s) -
K. Lee,
J.J. Lee,
Chang Hee Suh
Publication year - 2016
Publication title -
so'seong ga'gong/soseong gagong
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kstp.2016.25.4.242
Subject(s) - coolant , computational fluid dynamics , blank , die (integrated circuit) , channel (broadcasting) , mechanical engineering , thermal , water cooling , computer simulation , materials science , engineering , mechanics , nuclear engineering , thermodynamics , simulation , physics , electrical engineering

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