Open AccessMechanical and Electrical Properties of Submicrocrystalline Cu-3%Ag Alloy
Author(s) -
Young Gun Ko,
C.W. Lee,
Seung Namgung,
D.H. Lee,
Dong Hyuk Shin
Publication year - 2009
Publication title -
so'seong ga'gong/soseong gagong
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2009.18.6.476
Subject(s) - materials science , microstructure , equiaxed crystals , alloy , ductility (earth science) , stacking fault energy , metallurgy , ultimate tensile strength , pressing , electrical resistivity and conductivity , grain size , composite material , creep , electrical engineering , engineering