Open AccessMechanical and Electrical Properties of Submicrocrystalline Cu-3%Ag Alloy
Author(s) -
Young Gun Ko,
Chang Woo Lee,
Sook NamGung,
Dong-Wan Lee,
Dong Hyuk Shin
Publication year - 2009
Publication title -
transactions of materials processing
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2009.18.6.476
Subject(s) - materials science , microstructure , equiaxed crystals , alloy , ductility (earth science) , stacking fault energy , metallurgy , ultimate tensile strength , pressing , electrical resistivity and conductivity , grain size , composite material , creep , electrical engineering , engineering
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom