Numerical and Experimental Study on Plate Forming Process using Flexible Die
Author(s) -
S.C. Heo,
Young-Ho Seo,
J.W. Park,
Tae-Wan Ku,
J. Kim,
Beom-Soo Kang
Publication year - 2008
Publication title -
transactions of materials processing
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2008.17.8.570
Subject(s) - die (integrated circuit) , forming processes , finite element method , materials science , structural engineering , mechanical engineering , engineering , composite material
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