Open AccessFE-simulation of Drawing Process for Al-1%Si Bonding Wire Considering Fine Si Particle
Publication year - 2006
Publication title -
so'seong ga'gong/soseong gagong
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2006.15.6.421
Subject(s) - materials science , particle (ecology) , process (computing) , wire bonding , metallurgy , crystallography , mechanical engineering , engineering physics , computer science , engineering , electrical engineering , geology , chemistry , chip , oceanography , operating system