Open AccessFE-simulation of Drawing Process for Al-1%Si Bonding Wire Considering Fine Si Particle
Author(s) -
Dae-Cheol Ko,
Woonbong Hwang,
S.K. Lee,
B.M. Kim
Publication year - 2006
Publication title -
transactions of materials processing
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2006.15.6.421
Subject(s) - materials science , particle (ecology) , process (computing) , wire bonding , metallurgy , crystallography , mechanical engineering , engineering physics , computer science , engineering , electrical engineering , geology , chemistry , chip , oceanography , operating system
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