Open AccessAn Experimental Study for the Filling Balance of the Family Mold
Author(s) -
H P Park,
S. Balasivanandha Prabu,
Byungohk Rhee
Publication year - 2006
Publication title -
transactions of materials processing
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2006.15.1.047
Subject(s) - mold , materials science , molding (decorative) , composite material , volume (thermodynamics) , mechanical engineering , mechanics , engineering , physics , thermodynamics
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