Open AccessA Study of Interface Heat Transfer Coefficient Between Die and Workpiece for Hot Forging
Publication year - 2005
Publication title -
so'seong ga'gong/soseong gagong
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2005.14.5.460
Subject(s) - die (integrated circuit) , materials science , forging , heat transfer coefficient , metallurgy , pressure coefficient , heat transfer , composite material , thermodynamics , physics , nanotechnology