Open AccessA Study of Interface Heat Transfer Coefficient Between Die and Workpiece for Hot Forging
Author(s) -
Jong Won Kwon,
Jeong Yong Lee,
Y S Lee,
Youngeun Kwon,
Won-Byeong Bae
Publication year - 2005
Publication title -
transactions of materials processing
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2005.14.5.460
Subject(s) - die (integrated circuit) , materials science , forging , heat transfer coefficient , metallurgy , pressure coefficient , heat transfer , composite material , thermodynamics , physics , nanotechnology
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