Open AccessEvaluation of Punching Process Variables Influencing Micro Via-hole Quality of LTCC Green Sheet
Author(s) -
SeungWook Baek,
S H Rhim,
Se-Yeong Oh
Publication year - 2005
Publication title -
transactions of materials processing
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2005.14.3.277
Subject(s) - punching , conductor , ceramic , process (computing) , materials science , mechanical engineering , sheet resistance , die (integrated circuit) , quality (philosophy) , composite material , engineering drawing , engineering , computer science , philosophy , epistemology , layer (electronics) , operating system
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