Open AccessEvaluation of Punching Process Variables Influencing Micro Via-hole Quality of LTCC Green Sheet
Publication year - 2005
Publication title -
so'seong ga'gong/soseong gagong
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2005.14.3.277
Subject(s) - punching , conductor , ceramic , process (computing) , materials science , mechanical engineering , sheet resistance , die (integrated circuit) , quality (philosophy) , composite material , engineering drawing , engineering , computer science , philosophy , epistemology , layer (electronics) , operating system