Open AccessDesign Modification of the Stamping Die for the Improvement of Surface Quality of the Front End Module Carrier Upper Member
Author(s) -
SungHoon Kim
Publication year - 2005
Publication title -
transactions of materials processing
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2005.14.2.153
Subject(s) - die (integrated circuit) , stamping , blank , mechanical engineering , finite element method , front and back ends , quality (philosophy) , process (computing) , surface (topology) , sheet metal , structural engineering , engineering , stroke (engine) , engineering drawing , materials science , computer science , geometry , mathematics , physics , quantum mechanics , operating system
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