Finite Element Analysis of Copper Clad Steel Wire Drawing Process
Author(s) -
Hyoung Seop Kim,
B M Kim,
H.H. Jo,
Hongki Jo
Publication year - 2005
Publication title -
transactions of materials processing
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2005.14.2.147
Subject(s) - die (integrated circuit) , materials science , finite element method , core (optical fiber) , copper , reduction (mathematics) , metallurgy , wire drawing , composite material , structural engineering , mechanical engineering , engineering , geometry , mathematics , nanotechnology
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