Open AccessEstimate of Current Density Distribution in Electroforming Process Using Finite Element Analysis
Publication year - 2004
Publication title -
so'seong ga'gong/soseong gagong
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2004.13.3.279
Subject(s) - electroforming , current density , cathode , anode , electroplating , current (fluid) , materials science , electrochemistry , finite element method , mechanics , electrode , electrical engineering , thermodynamics , chemistry , nanotechnology , engineering , physics , layer (electronics) , quantum mechanics