Open AccessMRR model for the CMP Process Considering Relative Velocity
Publication year - 2004
Publication title -
transactions of materials processing
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2004.13.3.225
Subject(s) - wafer , chemical mechanical planarization , relative velocity , abrasion (mechanical) , slurry , mechanics , oscillation (cell signaling) , materials science , semiconductor device modeling , semiconductor , mechanical engineering , polishing , metallurgy , composite material , engineering , physics , optoelectronics , chemistry , classical mechanics , biochemistry , cmos
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