
Thickness Effect of Double Layered Sheet on Burr Formation during Micro-Via Hole Punching Process
Publication year - 2004
Publication title -
so'seong ga'gong/soseong gagong
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2004.13.1.065
Subject(s) - punching , materials science , process (computing) , composite material , structural engineering , mechanical engineering , engineering , computer science , operating system