Open AccessResearch on NiCoB Diffusion Barrier Film Prepared by Electroless Deposition for ULSI-Cu Metallization
Author(s) -
Zhichao Yang,
X. H. Chen,
W. H.,
Yuanvuan Wang,
K. Chen,
Jiaxian Han
Publication year - 2018
Language(s) - English
Resource type - Conference proceedings
DOI - 10.5220/0007439704250433
Subject(s) - diffusion barrier , materials science , diffusion , electroless deposition , deposition (geology) , optoelectronics , metallizing , metallurgy , copper , nanotechnology , layer (electronics) , metal , paleontology , physics , sediment , thermodynamics , biology
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