Open AccessResearch on NiCoB Diffusion Barrier Film Prepared by Electroless Deposition for ULSI-Cu Metallization
Author(s) -
Zhichao Yang,
X. H. Chen,
W. H.,
Y. C. Wang,
K. Chen,
Jiaxian Han
Publication year - 2018
Language(s) - English
Resource type - Conference proceedings
DOI - 10.5220/0007439704250433
Subject(s) - diffusion barrier , materials science , electroless deposition , deposition (geology) , diffusion , metallurgy , optoelectronics , engineering physics , nanotechnology , copper , engineering , layer (electronics) , geology , paleontology , physics , sediment , thermodynamics