Open AccessMODEL FOR PREDICTION OF PERFORMANCE RELIABILITY OF PRINTED CIRCUIT BOARDS TAKING INTO ACCOUNT CYCLES OF OPERATING TIME AND TEMPERATURE REGIMES OF USING
Author(s) -
С. М. Боровиков,
Vladislav N. Bondarev
Publication year - 2021
Publication title -
globus: tehničeskie nauki
Language(s) - English
Resource type - Journals
ISSN - 2713-3079
DOI - 10.52013/2713-3079-40-4-4
Subject(s) - printed circuit board , reliability (semiconductor) , installation , short circuit , circuit reliability , electronic circuit simulation , computer science , mechanical engineering , electronic circuit , engineering , electronic engineering , electrical engineering , voltage , physics , power (physics) , quantum mechanics
A model is proposed for predicting the operational reliability of printed circuit boards, which include mounting holes for installing output elements and contact pads for mounting SMD elements on the surface of a printed circuit board. A distinctive feature of the model is taking into account the cyclical nature of the operation of the electronic module and taking into account the thermo mechanical stresses that arise in the printed circuit board and connections when the temperature changes (during operation, during storage). An example of the application of the model is given.