Open Access3.2.3 Wafer-Level-3D-Integrationsverfahren für hochsensitive optische Sensoren
Author(s) -
L. Kalwa,
Stefan Gläsener,
J. Ruskowski,
Martin Figge,
H. Kappert,
H. Vogt
Publication year - 2019
Publication title -
tagungsband
Language(s) - Uncategorized
Resource type - Conference proceedings
DOI - 10.5162/sensoren2019/3.2.3
Subject(s) - wafer , physics , materials science , optoelectronics
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