
2.2.4 Hybridintegration von Mikrodehnungssensoren
Author(s) -
T. Frank,
A. Grün,
M. Kermann,
A. Cyriax,
A. Steinke,
T. Ortlepp,
G. Reschke
Publication year - 2019
Publication title -
tagungsband
Language(s) - Uncategorized
Resource type - Conference proceedings
DOI - 10.5162/sensoren2019/2.2.4
Subject(s) - computer science