Open Access1.1.2 HoloPort - 3D-Sensor for machine tools
Author(s) -
Tobias Seyler,
Johannes Engler
Publication year - 2019
Publication title -
tagungsband
Language(s) - Uncategorized
Resource type - Conference proceedings
DOI - 10.5162/sensoren2019/1.1.2
Subject(s) - computer science , machine tool , component (thermodynamics) , process (computing) , wireless sensor network , real time computing , computer hardware , embedded system , engineering , mechanical engineering , computer network , physics , thermodynamics , operating system