Open AccessB5.1 - Flip-chip package for pressure sensors with operationtemperatures up to 500 °C
Author(s) -
R. Zeiser,
P. Wagner,
Suleman Ayub,
Jürgen Wilde,
Stefan Henneck
Publication year - 2015
Publication title -
proceedings sensor 2015
Language(s) - English
Resource type - Conference proceedings
DOI - 10.5162/sensor2015/b5.1
Subject(s) - flip chip , flip , computer science , chip , materials science , telecommunications , nanotechnology , chemistry , apoptosis , biochemistry , adhesive , layer (electronics)