Open AccessB5.1 - Flip-chip package for pressure sensors with operationtemperatures up to 500 °C
Author(s) -
R. Zeiser,
Philipp Wagner,
Suleman Ayub,
Jürgen Wilde,
Stefan Henneck
Publication year - 2015
Publication title -
proceedings sensor 2011
Language(s) - English
Resource type - Conference proceedings
DOI - 10.5162/sensor2015/b5.1
Subject(s) - flip chip , computer science , chip , materials science , electronic engineering , engineering , telecommunications , nanotechnology , adhesive , layer (electronics)
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