Open AccessB3.2 - A new packaging approach for reliable high temperature MEMS devices based on multilayer ceramic interposers
Author(s) -
Frank Roscher,
Alexander Otto,
R. Döring,
Sven Rzepka,
M. Wiemer,
Martin Ihle,
St. Ziesche
Publication year - 2013
Publication title -
proceedings sensor 2013
Language(s) - English
Resource type - Conference proceedings
DOI - 10.5162/sensor2013/b3.2
Subject(s) - microelectromechanical systems , fabrication , materials science , interconnection , reliability (semiconductor) , interposer , ceramic , wafer , silicon , wafer level packaging , through silicon via , material selection , mechanical engineering , computer science , optoelectronics , nanotechnology , etching (microfabrication) , engineering , composite material , layer (electronics) , medicine , computer network , power (physics) , alternative medicine , physics , pathology , quantum mechanics
In this work, we will describe a promising procedure for the development of a silicon based micro electro mechanical system (MEMS) suitable for 300 °C operation temperature. Design aspects as well as a suitable packaging concept and technology will be highlighted. The value of accompanying FEM simulations together with the usage of novel reliability tools will be demonstrated as a design and construction accelerator that can help to avoid typical mistakes within the material selection and concept phase of a MEMS fabrication process. We will give an introduction for suitable wafer-levelbonding methods for multilayer stacking of functional substrates especially for the heterogeneous integration of silicon and low temperature co-fired ceramic LTCC (low temperature co-firing ceramic). The fabrication process for LTCC with electrical feed troughs and for Silicon substrates with through silicon vias TSVs (through-silicon via) and a subsequent electrical interconnection between both will also be topics of this work