Open AccessB3.1 - Assembly and Interconnection Technologies for Sensors for Very High Temperature Applications
Author(s) -
Jürgen Wilde,
P. Wagner,
R. Zeiser
Publication year - 2013
Publication title -
proceedings sensor 2013
Language(s) - English
Resource type - Conference proceedings
DOI - 10.5162/sensor2013/b3.1
Subject(s) - interconnection , computer science , materials science , computer network