Open AccessB3.1 - Assembly and Interconnection Technologies for Sensors for Very High Temperature Applications
Author(s) -
Jürgen Wilde,
Philipp Wagner,
R. Zeiser
Publication year - 2013
Publication title -
proceedings sensor 2011
Language(s) - English
Resource type - Conference proceedings
DOI - 10.5162/sensor2013/b3.1
Subject(s) - materials science , soldering , interconnection , ceramic , substrate (aquarium) , silicon carbide , brazing , die (integrated circuit) , reliability (semiconductor) , optoelectronics , microelectromechanical systems , mechanical engineering , composite material , computer science , nanotechnology , engineering , computer network , power (physics) , oceanography , physics , alloy , quantum mechanics , geology
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