B5.2 - Packaging Challenges for Monolithically Integrated Mircosensors | Zendy

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B5.2 - Packaging Challenges for Monolithically Integrated Mircosensors

Author(s) -

M. Streiff

Publication year - 2011

Publication title -

proceedings sensor 2011

Language(s) - Uncategorized

Resource type - Conference proceedings

DOI - 10.5162/sensor11/b5.2

Subject(s) - computer science

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