B4.1 - Trends in Assembly and Packaging of Sensors | Zendy

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B4.1 - Trends in Assembly and Packaging of Sensors

Author(s) -

Juergen Wilde

Publication year - 2009

Language(s) - English

Resource type - Conference proceedings

DOI - 10.5162/sensor09/v1/b4.1

Subject(s) - electronic packaging , computer science , engineering , electrical engineering

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