Open AccessCopper Electrode Material using Copper Formate-Bicarbonate Complex for Printed Electronics
Author(s) -
Jaeeun Hwang,
Sinhee Kim,
Kevin Ray Ayag,
Hongdoo Kim
Publication year - 2014
Publication title -
bulletin of the korean chemical society
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.237
H-Index - 59
eISSN - 1229-5949
pISSN - 0253-2964
DOI - 10.5012/bkcs.2014.35.1.147
Subject(s) - copper , formic acid , formate , electrical resistivity and conductivity , formaldehyde , calcination , printed electronics , omega , methanol , chemistry , methyl formate , inorganic chemistry , materials science , analytical chemistry (journal) , inkwell , composite material , metallurgy , organic chemistry , physics , catalysis , quantum mechanics