Open AccessEXPERIMENTAL DETERMINATION OF HEAT TRANSFER COEFFICIENT BY NATURAL CONVECTION FOR A COMMERCIALLY AVAILABLE HEAT SINK USED FOR COOLING OF ELECTRONIC CHIPS
Author(s) -
Sunil Hireholi,
K. S. Shashishekhar,
Samuel Milton
Publication year - 2014
Publication title -
international journal of mechanical and industrial engineering
Language(s) - English
Resource type - Journals
ISSN - 2231-6477
DOI - 10.47893/ijmie.2014.1165
Subject(s) - heat sink , heat transfer coefficient , thermocouple , materials science , heat transfer , thermodynamics , mechanics , electromagnetic coil , nuclear engineering , natural convection , mechanical engineering , electrical engineering , composite material , engineering , physics
Measurements have been conducted for experimentally determining the heat transfer co-efficient of a commercially available heat sink employed in electronic circuits. For determining the heat transfer coefficient the chip is replaced with a heating coil. The power input to the heating coil is obtained by measuring the input voltage and current. Temperature measurement for varying heat inputs is done using RTD thermocouples. Heat transfer co-efficient is computed from the measured data. This is done for different configurations of the heat sink.