Open AccessLarge Area Wafer-Level High-Power Electronic Package Using Temporary Bonding and Debonding with Double-Sided Thermal Release Tape
Author(s) -
Yong-Sik Hwang,
IlSuk Kang,
GaWon Lee
Publication year - 2022
Publication title -
journal of sensor science and technology
Language(s) - English
Resource type - Journals
eISSN - 2093-7563
pISSN - 1225-5475
DOI - 10.46670/jsst.2022.31.1.36
Subject(s) - wafer , materials science , power (physics) , thermal , wafer bonding , composite material , optoelectronics , electrical engineering , engineering , physics , quantum mechanics , meteorology
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