Open AccessWafer-level Vacuum Packaging of a MEMS Resonator using the Three-layer Bonding Technique
Author(s) -
Chung Mo Yang,
Hee Yeoun Kim,
Jong Cheol Park,
Ye Eun Na,
Tae Hyun Kim,
Kil Son Noh,
Gap Seop Sim,
Ki Hoon Kim
Publication year - 2020
Publication title -
journal of sensor science and technology
Language(s) - English
Resource type - Journals
eISSN - 2093-7563
pISSN - 1225-5475
DOI - 10.46670/jsst.2020.29.5.354
Subject(s) - wafer , microelectromechanical systems , wafer level packaging , materials science , wafer bonding , optoelectronics , vacuum packing , vacuum level , resonator , layer (electronics) , wafer scale integration , die preparation , nanotechnology , mechanical engineering , engineering , wafer dicing , physics , quantum mechanics
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