Open AccessHigh-Level Crosstalk Model in N-Coupled Through-Silicon Vias (TSVs)
Author(s) -
H. Lee,
J. K. Park,
J. T. Kim
Publication year - 2018
Publication title -
advances in electrical and computer engineering
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.254
H-Index - 23
eISSN - 1844-7600
pISSN - 1582-7445
DOI - 10.4316/aece.2018.03002
Subject(s) - spice , crosstalk , electronic engineering , computer science , noise (video) , reliability (semiconductor) , reliability engineering , engineering , power (physics) , physics , artificial intelligence , quantum mechanics , image (mathematics)