Open AccessOptimisation of a microelectronic assembly package using response surface methodology
Author(s) -
Mathias Ekpu
Publication year - 2021
Publication title -
nigerian journal of technology
Language(s) - English
Resource type - Journals
eISSN - 2467-8821
pISSN - 0331-8443
DOI - 10.4314/njt.v39i4.12
Subject(s) - microelectronics , response surface methodology , central composite design , heat sink , thermal resistance , materials science , chip , design–expert , thermal conduction , finite element method , optimal design , thermal , mechanical engineering , design of experiments , composite material , engineering , structural engineering , computer science , optoelectronics , electrical engineering , mathematics , thermodynamics , physics , machine learning , statistics
This article addressed heat conduction in microelectronics applications. ANSYS finite element design software was used to design the model, while Design Expert software was used for the response surface methodology (RSM) analysis. The components analysed were heat-sink base (HSB) thickness, thermal interface material (TIM) thickness, and chip thickness. A design of experiment comprising of 15 central composite design (CCD) for the coded levels (low (-) and high (+)) of the factors were generated. Heat flow was applied to the chip while a convective coefficient was applied to the heat-sink. The temperature solution was used to calculate the thermal resistance response for the 15 CCD experimental runs. The results from the RSM study proposed an optimal (minimization analysis) combination of 3.5 mm, 0.04 mm, and 0.75 mm, for HSB thickness, TIM thickness, and chip thickness respectively. While the optimal mean thermal resistance of 0.31052 K/W was achieved from the proposed optimal parameters.
Keywords: RSM; CCD; thermal resistance; temperature; microelectronics