Open AccessUse of Hard Mask for Finer (<10 μm) Through Silicon Vias (TSVs) Etching
Author(s) -
Somang Choi,
Sang Jeen Hong
Publication year - 2015
Publication title -
transactions on electrical and electronic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.201
H-Index - 18
eISSN - 2092-7592
pISSN - 1229-7607
DOI - 10.4313/teem.2015.16.6.312
Subject(s) - materials science , etching (microfabrication) , silicon , optoelectronics , dry etching , engineering physics , nanotechnology , layer (electronics) , engineering
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