Open AccessDiamond Conditioner Wear Characterization for a Copper CMP Process
Author(s) -
L. Boruckia,
Yong Zhuang,
Ryozo Kikuma,
Naoki Rikita,
Takahiro Yamashita,
Kenji Nagasawa,
H. Lee,
Ting Sun,
D. Rosales-Yeomans,
Ara Philipossian,
Tom Stout
Publication year - 2007
Publication title -
transactions on electrical and electronic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.201
H-Index - 18
eISSN - 2092-7592
pISSN - 1229-7607
DOI - 10.4313/teem.2007.8.1.015
Subject(s) - materials science , copper , diamond , metallurgy , characterization (materials science) , nanotechnology
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