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Dishing and Erosion Evaluations of Tungsten CMP Slurry in the Orbital Polishing System
Author(s) -
SangHo Lee,
Young-Jae Kang,
Jin-Goo Park,
Pan-Ki Kwon,
Chang-Il Kim,
Chan-Kwon Oh,
Soo-Myoung Kim,
Myung-S. Jhon,
Se-An Hur,
Youngjung Kim,
Bong-Ho Kim
Publication year - 2006
Publication title -
transactions on electrical and electronic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.201
H-Index - 18
eISSN - 2092-7592
pISSN - 1229-7607
DOI - 10.4313/teem.2006.7.4.163
Subject(s) - materials science , slurry , polishing , tungsten , wafer , chemical mechanical planarization , metallurgy , erosion , tungsten oxide , composite material , optoelectronics , paleontology , biology

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