Open AccessSuggestion and Design of GaN on Diamond Structure for an Ideal Heat Dissipation Effect and Evaluation of Heat Transfer Simulation as Different Adhesion Layer
Author(s) -
Jong Cheol Kim,
Chan Il Kim,
Seung-Han Yang
Publication year - 2017
Publication title -
journal of the korean institute of electrical and electronic material engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2017.30.5.270
Subject(s) - materials science , dissipation , ideal (ethics) , diamond , heat transfer , thermal management of electronic devices and systems , layer (electronics) , composite material , mechanical engineering , mechanics , engineering , thermodynamics , philosophy , physics , epistemology
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