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Thermal Analysis for Improvement of Heat Dissipation Performance of the Rail Anchoring Failure Detection Module
Author(s) -
Won kyu Chae,
Young Park,
Sam young Kwan,
Jaehyeong Lee
Publication year - 2016
Publication title -
journal of the korean institute of electrical and electronic material engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2016.29.2.125
Subject(s) - thermal management of electronic devices and systems , anchoring , dissipation , materials science , thermal , automotive engineering , structural engineering , mechanical engineering , engineering , physics , thermodynamics

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