Open AccessA Study of Properties of Sn-3Ag-0.5Cu Solder Based on Phosphorous Content of Electroless Ni-P Layer
Author(s) -
An-Seob Shin,
Dae-Yool Ok,
Giho Jeong,
Minju Kim,
Chang-Sik Park,
Jin-Ho Kong,
Cheol-Ho Heo
Publication year - 2010
Publication title -
journal of the korean institute of electrical and electronic material engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2010.23.6.481
Subject(s) - materials science , soldering , ball grid array , kirkendall effect , intermetallic , metallurgy , scanning electron microscope , solderability , electron microprobe , layer (electronics) , energy dispersive x ray spectroscopy , composite material , alloy
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