Open AccessCharacterization of Electrical Resistance for SABiT Technology-Applied PCB : Dependence of Bump Size and Fabrication Condition
Author(s) -
Chulho Song,
Younghun Kim,
Sangmin Lee,
JeeSoo Mok,
YongSuk Yang
Publication year - 2010
Publication title -
journal of the korean institute of electrical and electronic material engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2010.23.4.298
Subject(s) - fabrication , materials science , scanning electron microscope , interconnection , composite material , contact resistance , electrical resistivity and conductivity , printed circuit board , electrical engineering , engineering , telecommunications , medicine , alternative medicine , pathology , layer (electronics)
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