Open AccessImprovement of COF Bending-induced Lead Broken Failure in LCD Module
Author(s) -
Boum-Joo Shim,
Yeol Choi,
Junsin Yi
Publication year - 2008
Publication title -
journal of the korean institute of electrical and electronic material engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2008.21.3.265
Subject(s) - materials science , printed circuit board , composite material , liquid crystal display , lead (geology) , stress (linguistics) , bending , chip , surface finish , flip chip , optoelectronics , electrical engineering , layer (electronics) , engineering , linguistics , philosophy , adhesive , geomorphology , geology
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