Open AccessEffect of Temperature on Polishing Properties in Oxide CMP
Author(s) -
YoungJin Kim,
Boum-Young Park,
Hyoungjae Kim,
Hae-Do Jeong
Publication year - 2008
Publication title -
journal of the korean institute of electrical and electronic material engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2008.21.2.093
Subject(s) - wafer , rotational speed , polishing , chemical mechanical planarization , head (geology) , materials science , slurry , composite material , oxide , engineering drawing , mechanical engineering , metallurgy , optoelectronics , engineering , geomorphology , geology
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