Open AccessDevelopment of 121 pins/mm2High Density Probe Card using Micro-spring Architecture
Author(s) -
Chul-Hong Min,
Tae Seon Kim
Publication year - 2007
Publication title -
journal of the korean institute of electrical and electronic material engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2007.20.9.749
Subject(s) - bumping , microelectromechanical systems , wafer , fabrication , contact resistance , chip , spring (device) , materials science , tension (geology) , scratch , nanotechnology , optoelectronics , mechanical engineering , electrical engineering , electronic engineering , composite material , engineering , ultimate tensile strength , layer (electronics) , medicine , alternative medicine , pathology
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