Open AccessStability and Improvement of Polishing Pad in W CMP
Publication year - 2007
Publication title -
jeon'gi jeonja jaeryo haghoe nonmunji/jeon-gi jeonja jaeryo hakoe nonmunji
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2007.20.12.1027
Subject(s) - polishing , chemical mechanical planarization , materials science , abrasive , surface roughness , wafer , composite material , surface finish , wetting , machining , engineering drawing , metallurgy , optoelectronics , engineering